This is what the new Intel chip looks like that will be in the future line of computers with folding or dual screens, based on the design of the Core i5 and Core i3 processors
Beyond the segment of personal computers, desktops and laptops, and mobile devices such as tablets and smartphones, the technology industry launched several models of equipment with folding screens and dual display systems . The diversification of equipment categories led Intel to develop its new Lakefield chip platform , a hybrid technology that uses the electronic component packaging system known as Foveros 3D .
Based on the Core i5 and Core i3 line , the new Intel hybrid chips will be present in the Lenovo ThinkPad X1 Fold and Samsung Galaxy Book S computers . According to Intel, Lakefield processors are the smallest on the market and have full compatibility with Windows 10 applications . In turn, the new processors have up to 56 percent smaller processor area compared to the Core i7 , in addition to offering longer battery life .
Official introduction of Intel’s Lakefield chips
Available in the Intel Core i5-16G7 and Intel Core i3-13G4 versions , they feature five cores and 7W thermal design power . In turn, these microprocessors have dual channels for connection to the screen, a feature that adjusts to the new generation of devices with folding panels or systems that combine two displays.
Manufactured based on a 10-nanometer design , Lakefield processors are compatible with 32- and 64-bit Windows applications, accompanied by an Intel Gen11 graphics chip. With support for Wi-Fi 6 and LTE connectivity, this new line of Intel hybrid processors will seek to be present in the next releases of computers and devices focused on mobility and the use of new screen designs, such as the Lenovo ThinkPad X1 laptop. Fold with a foldable OLED screen and the Samsung Galaxy Book S convertible notebook.